Test and validationPCT5801 · DeepTouch1000 · motherboards · PSTA20K
Probe assemblyProbe placement and laser micro-welding
Cleaning and reinspectionCleaning and three-direction reinspection
Smart storageStorage and traceability
Prober servicesInformation box · uP200A · pre-owned equipment
Probe-card hallMEMS probe-card manufacturing and validation · 21 stationsAPM90A (TSK, 200 mm)
Tokyo Seimitsu 8-inch fully automatic prober, installed in volume between 1994 and 1997.
- Wafer size
- 4–8inch
- Overall accuracy
- 5µm or better
- Index time
- 250ms
- Machine weight
- approx. 750kg
CP hall
Modelled on the actual machines: six probers in the north row, four tester docking cells in the south row, and four boards on the wall showing real screens from the information box.
Probing products
In production 1
Engineering stage 1
In development 5
Third-party machines
Refurbished supply 6
Serviced model 3
Agent 1
Drag to orbit · scroll to zoom · click a machine or board
UF200 (TSK, 200 mm)
TSK 8-inch workhorse installed after 1998, fully refurbished to UF200A standard.
- Wafer size
- 5 / 6 / 8inch
- Overall accuracy
- 5µm
- Start-up time
- approx. 70s
- Dies per wafer
- up to 100,000dies
UF200 barcode scanner and LOT entry
The scanner writes the LOT through a relay into the machine's native barcode port; nothing is sent if validation fails.
- Entry
- Nativebarcode port
- LOT validation
- 18character limit
- Extraction rule
- Regexconfigured per site barcode
- Machine program
- Untouched
Prober information box
Mounted outside the machine; reads out output, cumulative probe-card touchdowns and wafer geometry.
- Connection
- Bolt-onmachine unchanged
- Data
- Config card+ run memory
- Screens
- 4board pages
- Source
- Page by pagegrade marked
UF3000 (ACCRETECH, 200/300 mm)
ACCRETECH 12-inch model from 2005 onward, compatible with 8- and 12-inch wafers.
- Wafer size
- 200 / 300mm
- Overall accuracy
- ±2µm · published data
- Chuck temperature control
- −40…200°C · multiple ranges
- Platform
- 2002onward
UF3000ex (ACCRETECH 12-inch)
The grade of the UF3000 family aimed at high-pin-count, high-contact-force probe cards.
- Chuck force · standard
- 300kgf
- Chuck force · high rigidity
- 450kgf
- Overall accuracy
- ±1µm · published data
- Machine weight
- approx. 1,650kg
AP3000 (ACCRETECH, 300 mm)
The bridge beam on top of the machine cannot be removed; probe card and fixture solutions are designed to this boundary.
This station is a target of our probe card and fixture service; the machine itself is not on the supply list.
P-12XL (TEL, 300 mm)
Tokyo Electron 12-inch flat-top prober, installed around 2004.
- Wafer size
- 300 / 200mm
- Overall accuracy
- X/Y ±4µm · published data
- Chuck force · standard
- 80kgf
- Machine weight
- approx. 1,640kg
Advantest V93000 docking cell
The test head flips down and docks rigidly to the prober head plate.
Our 93000 PS400 configuration is fully refurbished and comes with a one-year warranty (under 2023 supply conditions).
Advantest T5833 docking cell
Memory tester: the test head presses face down onto the prober head plate.
We developed the motherboard / WMB for this platform in-house, including the 32 TOM configuration.
Teradyne M5 (Magnum 5) docking cell
Electronics are integrated in the body and connect to the probe card directly through the K52 interface.
Our sales and repair scope covers the Magnum 5, and our own probe-card test solution has been adapted to this platform.
Advantest EVA100 cable-connected cell
A bench-top test unit sits on a stand, with one flat cable to the prober.
We use the EVA100 as the test front end to build socket and probe-card test solutions.
Porous gold-plated chuck
More than 3,000 dense suction holes, gold-plated with no grooves, flatness 5 µm.
- Suction holes
- 3,000+holes
- Surface
- Gold-platedno grooves
- Flatness
- 5µm
- Fits
- APM90A· UF200 series
Production board · Live overview
One screen shows what this batch is running, how far it has got and how it is doing.
- Data
- Read-onlyfrom machine counters
- Not obtained
- --not inferred, not filled in
Production board · Live UF200 screen
The machine's native screen is mirrored read-only to the web and the boards.
- Mirror
- Read-onlyshown as is
- Remote operation
- Optionalread-only by default
Production board · External wafer map
The whole-wafer die map and the status of each link share one screen.
- Unconnected link
- NOT CONNECTED
- Adapter
- READ ONLY
Production board · SECS/GEM and EAP interface
Verify the machine's native GEM / HSMS program and first draw a line around the interface scope that can be confirmed.
- Per-layer marking
- Evidence in hand/ to be inferred / blocked
- Overhead hoist
- Not fittedAMHS is part of the upgrade scheme
Retrofit and connectivity for older machines
The prober itself is left unchanged; a layer of control system, barcode entry and data is added outside it. On a desktop browser, the viewpoint buttons above the hall take you straight to the probers, the docking area or the boards.
Schematic
Retrofit
uP200A control system upgrade
Replaces the control system of APM90A and UF200 series probers; supports 250,000 dies per wafer.
Model renderingInformation box
Mounted outside the prober; reads out output, cumulative probe-card touchdowns and wafer geometry.
Model renderingBarcode scanner and LOT handling
Scans are written through a relay to the native barcode port; LOT validation limit is 18 characters.
Model rendering · suction holes not drawnPorous gold-plated chuck top
More than 3,000 suction holes, gold-plated with no grooves; fits APM90A and UF200 series.
Probers in service
Six 8-inch and 12-inch probers in the north row. Refurbished machines are delivered after serial number, configuration and condition are checked unit by unit; about 100 in stock (as of August 2026).
Model renderingAPM90A · 8-inch
The generation before the Tokyo Seimitsu UF200, installed in volume between 1994 and 1997.
Model renderingUF200 · 8-inch
Fully refurbished at the Wuxi refurbishment base to UF200A standard, with all functions enabled.
Model renderingUF3000 · 8 / 12-inch
Whole-machine refurbishment, parameter re-verification and on-site installation, in ambient and hot/cold configurations.
Model renderingUF3000ex · 12-inch
Chuck force 300 kgf standard, 450 kgf in the high-rigidity configuration; checked machine by machine before quotation.
Model renderingP-12XL · 12-inch
Chuck force 80 kgf standard, 100 kgf on the P-12XLn; the grade is confirmed at inquiry.
Model renderingAP3000 · 12-inch
Probe cards and fixtures are serviced for this machine; the machine itself is not on the supply list.
Tester docking
Four stations in the south row; each tester is docked to a prober, either pressed on or cabled.
Model renderingAdvantest V93000
93000 PS400 configuration, fully refurbished, with a one-year warranty.
Model renderingAdvantest T5833
Motherboards / WMBs developed in-house for this platform, including the 32 TOM configuration.
Model renderingTeradyne Magnum 5
Sales and repair; our own probe-card test solution has been adapted to this platform.
Model renderingAdvantest EVA100
Used as the test front end for socket and probe-card test solutions.
This page shows refurbishment, retrofit and delivery of pre-owned equipment. Maker model names appear here to define the range of machines we can take on; they do not indicate authorisation, certification or endorsement by those makers. Retrofit and rebuild work is carried out by us and remains our responsibility. EVA100 is Advantest's product; Probing is its representative and distributor. The hall is an illustrative scene built from real machine models and real screens; the overhead hoist transport (OHT) stands for the AMHS material flow the upgrade can connect to and is not part of this hall's configuration. The barcode scanner and the information box are our own development projects, and the badge on each one shows where it stands.
In development
Production boards
The four boards on the wall are real screens from the information box. Every number comes from the machine's own counters and configuration; anything not obtained shows --, with nothing inferred or filled in.
Related
Tell us the model, wafer size and test platform
We reply with the scope we can take on and a proposed solution for that model.