uP200AProber control system upgrade
uP200A lets APM90A and UF200 support 250,000 dies per wafer.
Model rendering · APM90A
Key figures
- Boot time
- 40sOriginal: APM90A about 180 s, UF200 70 s
- Dies supported per wafer
- 250,000diesOriginal: APM90A about 60,000, UF200 100,000
- Processing speed
- 3xRelative to UF200 · as stated in the catalogue
- Interface
- Full ChineseOriginal: English or Japanese
Same prober, a different control system
The upgrade replaces the control system and keeps the mechanical body, the original probe cards and the consumables. Boot time, the die limit per wafer, interface and data transfer all change with it.
Upgrade process
- 01Confirm machine and condition
Confirm the model, control system state and existing consumables to define the upgrade scope.
- 02Confirm data and interfaces
Confirm the mapping data format and host system interfaces, covering GPIB / TTL and network.
- 03Perform the upgrade
Replace the control system on site, keeping the mechanical body and the probe card consumables.
- 04Verify
Confirm boot time, die count, alignment and mapping output; measured results govern.
Applications
Capacity limited on an older machine
The mechanics are still usable but the control system's die limit and takt have become the bottleneck. After the upgrade a wafer supports 250,000 dies, and processing speed is stated in the catalogue as three times that of the UF200.
Interface and data format friction
The original machine runs an English or Japanese interface with floppy-only or floppy-plus-network data transfer. After the upgrade the interface is fully in Chinese and compatible with UF200 / UF200A data formats. Data can move by floppy, magneto-optical disk (MO) or network.
Protecting the existing consumable investment
The upgrade is compatible with APM90A and UF200 probe cards and consumables, so nothing has to be repurchased. The control system is replaced on site and the mechanical body is kept.
Auto-alignment and live mapping
Pad auto-alignment, tip auto-alignment and cleaning, and fail-mark check. Multi-probe probing and multi-bin output are supported, and an LCD touch monitor shows the mapping live. A GPIB / TTL interface connects to the host system.
Upgrade target and scope
The upgrade targets Tokyo Seimitsu APM90A and UF200 series probers in service. It supports 4, 5, 6 and 8 inch wafers, backward compatible. Current-generation probers are outside the scope.
The generation before the UF200: a 200 mm fully automatic prober installed across Korea, Japan and Taiwan between 1994 and 1997.
TSK's main 8 inch machine, installed from 1998 onward.
Upgrade lead time, spare part coverage and warranty terms are confirmed for each specific machine.
Maker model names appear here to define the range of machines we can take on; they do not indicate authorisation, certification or endorsement by those makers. The upgrade is carried out by us and remains our responsibility.
PhotographSpecifications
Full specification table (15 items)
| Item | Specification / configuration | Notes |
|---|---|---|
| Upgrade target | Tokyo Seimitsu APM90A and UF200 series probers in service | Mechanical body is retained |
| Wafer sizes | 4, 5, 6 and 8 inch | Backward compatible |
| Boot time | uP200A 40 s; UF200 70 s; APM90A about 180 s | Catalogue comparison table |
| Dies supported | uP200A 250,000; UF200 100,000; APM90A about 60,000 | Per wafer |
| Processing speed | Three times UF200 | As stated in the catalogue |
| Interface | Full Chinese | Original is English or Japanese |
| Data transfer | Floppy, magneto-optical disk (MO), network | Original offers floppy, or floppy plus network |
| Data format | Compatible with UF200 and UF200A data formats | The original APM90A is not |
| Consumable compatibility | Compatible with APM90A and UF200 probe cards and consumables | No repurchase required |
| Overall accuracy | 5 µm | As stated in the catalogue |
| Chuck | 8 inch nickel/gold heatable chuck | With the 8 inch control module |
| Functions | Pad auto-alignment, tip auto-alignment and cleaning, fail-mark check, multi-probe probing, multi-bin output, live mapping display | LCD touch monitor |
| Interfaces | GPIB / TTL | For host system integration |
| Utilities | Compressed air >0.4 MPa; vacuum >-53 kPa; single phase 220 V; max load current 6 A; max power 1.5 kVA | Site conditions must be met |
| Supplying entity | Shanghai Wenlan Trading / Shanghai Lude Integrated Circuit | Different from the probe card equipment supply entity |
Boot time, dies supported, data transfer and compatibility comparisons come from the model comparison table in the uP200A product catalogue. Items not listed follow the technical agreement.
Related pages
Tell us the original model, control system state and existing consumables
We will acknowledge receipt within one business day.
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