Probing Semiconductor
Prober that the chuck top fits

3000+ holes · no grooves · 5 μm flatness

Porous Gold-Plated Chuck Top

When a device conducts through its back side, a grooved chuck breaks the contact wherever a groove runs. This chuck replaces grooves with more than 3000 dense vacuum holes, gold-plates the surface for back-side conduction and wear, and holds 5 μm flatness across the face. It is a prober consumable, made to the machine model.

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Category visual of the prober. The chuck top is the carrier on it, made to the model dimensions.
Vacuum holes3000+ dense holes
SurfaceGold plated
StructureNo grooves
Flatness5 μm
The same points in words
Vacuum holes
Replaces groove suction
Surface
Back-side conduction and wear
Structure
Full-face contact
Flatness
Across the face
Equipment and engineering solution

Applications

Designed for the following probe card manufacturing, test and maintenance tasks.

MOSFET back-side conduction test

Consumable replacement on installed base

Contact yield investigation

The same points in words
MOSFET back-side conduction test
The device back must conduct across the full face; grooves leave contact gaps.
Consumable replacement on installed base
Chuck replacement on APM90A and UF200 series machines still in service.
Contact yield investigation
When contact faults cluster in one area, check carrier flatness and suction uniformity first.
SPECIFICATIONS

Specifications

The final configuration follows the card, interfaces, site conditions and acceptance items.

Hole countMore than 3000 dense vacuum holesNo groove structure
Surface finishGold platedBack-side conduction and wear resistance
Flatness5 μmAcross the whole face
Compatible modelsTokyo Seimitsu ACCRETECH APM90A, UF200, UF200A and UF200R seriesMade to the model dimensions
Typical useMOSFET and other back-side conducting devicesOther devices confirmed by sample
Supplying entityShanghai Wenlan TradingDifferent from the equipment supply entity
WORKFLOW

Workflow

  1. 01

    Confirm the machine

  2. 02

    Confirm the device

  3. 03

    Make and deliver

  4. 04

    Install and verify

The same points in words
Confirm the machine
Fix chuck dimensions and interface for APM90A or the UF200 series Series are not interchangeable
Confirm the device
Confirm back-side conduction and contact requirements Determines whether the gold face is needed
Make and deliver
Manufactured to the model and delivered A consumable, replaced with use
Install and verify
Confirm suction uniformity and test results after installation Measured contact results govern
FAT / SAT

Project delivery

01

Sample evaluation

02

Technical agreement

03

FAT

04

SAT

The same points in words
Sample evaluation
Confirm the object, interfaces, current state, failure modes and available validation samples.
Technical agreement
Define configuration, measurement method, limits, takt, data interfaces and responsibilities.
FAT
Verify functions, repeatability, reporting and exception handling with agreed samples.
SAT
Complete site integration, training, upstream/downstream interfaces and issue closure.
CONFIGURATION

Configuration and acceptance

System configuration, optional items and acceptance conditions are summarized below.

Source

Hole count, gold plating, grooveless structure, 5 μm flatness and model compatibility all come from the porous chuck product document.

Not published

Service life, holding force and temperature limit are not given in the source and must be confirmed for the operating condition.

Supplying entity

This product is supplied by Shanghai Wenlan Trading, which differs from the probe card equipment supply entity.

Share the card, interfaces and target

Send the sample, installed equipment, current issue and target takt. We will acknowledge receipt within one business day.

Submit a project requestuP200A Prober Control System Upgrade