3000+ holes · no grooves · 5 μm flatness
Porous Gold-Plated Chuck Top
When a device conducts through its back side, a grooved chuck breaks the contact wherever a groove runs. This chuck replaces grooves with more than 3000 dense vacuum holes, gold-plates the surface for back-side conduction and wear, and holds 5 μm flatness across the face. It is a prober consumable, made to the machine model.
Category visual of the prober. The chuck top is the carrier on it, made to the model dimensions.
Equipment and engineering solution
Applications
Designed for the following probe card manufacturing, test and maintenance tasks.
MOSFET back-side conduction test
The device back must conduct across the full face; grooves leave contact gaps.
Consumable replacement on installed base
Chuck replacement on APM90A and UF200 series machines still in service.
Contact yield investigation
When contact faults cluster in one area, check carrier flatness and suction uniformity first.
SPECIFICATIONS
Specifications
The final configuration follows the card, interfaces, site conditions and acceptance items.
| Item | Specification / configuration | Notes |
|---|---|---|
| Hole count | More than 3000 dense vacuum holes | No groove structure |
| Surface finish | Gold plated | Back-side conduction and wear resistance |
| Flatness | 5 μm | Across the whole face |
| Compatible models | Tokyo Seimitsu ACCRETECH APM90A, UF200, UF200A and UF200R series | Made to the model dimensions |
| Typical use | MOSFET and other back-side conducting devices | Other devices confirmed by sample |
| Supplying entity | Shanghai Wenlan Trading | Different from the equipment supply entity |
WORKFLOW
Workflow
Fix chuck dimensions and interface for APM90A or the UF200 series
Series are not interchangeable
Confirm back-side conduction and contact requirements
Determines whether the gold face is needed
Manufactured to the model and delivered
A consumable, replaced with use
Confirm suction uniformity and test results after installation
Measured contact results govern
FAT / SAT
Project delivery
Sample evaluation
Confirm the object, interfaces, current state, failure modes and available validation samples.
Technical agreement
Define configuration, measurement method, limits, takt, data interfaces and responsibilities.
FAT
Verify functions, repeatability, reporting and exception handling with agreed samples.
SAT
Complete site integration, training, upstream/downstream interfaces and issue closure.
CONFIGURATION
Configuration and acceptance
System configuration, optional items and acceptance conditions are summarized below.
Source
Hole count, gold plating, grooveless structure, 5 μm flatness and model compatibility all come from the porous chuck product document.
Not published
Service life, holding force and temperature limit are not given in the source and must be confirmed for the operating condition.
Supplying entity
This product is supplied by Shanghai Wenlan Trading, which differs from the probe card equipment supply entity.
Share the card, interfaces and target
Send the sample, installed equipment, current issue and target takt. We will acknowledge receipt within one business day.