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CP hallProbers, tester docking and retrofits of installed probers · 17 stationsPorous gold-plated chuck topWafer carrier
This chuck top replaces groove suction with more than 3,000 dense holes, for testing devices that conduct through the back side.
Key figures
- Dense vacuum holes
- 3,000+holesReplaces groove suction
- Flatness
- 5µmAcross the whole face
- Surface finish
- Gold platedBack-side conduction and wear resistance
- Structure
- No groovesFull-face contact
Back-side conduction needs contact across the whole face
When a device conducts through its back side, there can be no grooves between wafer and chuck. This chuck replaces groove suction with dense vacuum holes, gold-plates the surface, and holds 5 µm flatness across the face.
Illustration, not to scale. Top view above, cross-section below; groove and hole layouts are schematic.
Applications
MOSFET back-side conduction test
The device back must conduct across the full face; grooves leave contact gaps. Other devices are confirmed by sample.
Consumable replacement on installed base
Chuck replacement on APM90A and UF200 series machines still in service, without replacing the whole machine.
Contact yield investigation
When contact faults cluster in one area, check carrier flatness and suction uniformity first.
Refurbishing chuck tops in service
The chuck top is a consumable part of the prober. A chuck top in service can be refurbished: cleaned, re-plated and re-checked for flatness.
From confirming the machine to installation check
- Confirm the machineFix chuck dimensions and interface for APM90A or the UF200 series; the series are not interchangeable.
- Confirm the deviceConfirm back-side conduction and contact requirements; hole distribution and plating are chosen for the use.
- Make and deliverMade to the machine model. The vacuum face is protected separately, and an inspection record is supplied with the part.
- Install and verifyReplaced on site, with suction uniformity and contact state re-measured; measured contact results govern.
Specifications
Full specification table (6 items)
| Item | Specification / configuration | Notes |
|---|---|---|
| Hole count | More than 3,000 dense vacuum holes | No groove structure |
| Surface finish | Gold plated | Back-side conduction and wear resistance |
| Flatness | 5 µm | Across the whole face |
| Compatible models | Tokyo Seimitsu ACCRETECH APM90A, UF200, UF200A and UF200R series | Made to the model dimensions; the series are not interchangeable |
| Typical use | MOSFET and other back-side conducting devices | Other devices confirmed by sample |
| Supplying entity | Shanghai Wenlan Trading | Different from the equipment supply entity |
Service life, holding force and temperature limit are not given in the source and must be confirmed for the operating condition. Items not listed follow the technical agreement.
Maker model names appear here to define the range of machines we can take on; they do not indicate authorisation, certification or endorsement by those makers. Retrofit and rebuild work is carried out by us and remains our responsibility. The chuck top is supplied by Shanghai Wenlan Trading.
Related pages
Tell us the machine model and the device
Send your installed equipment, device and current issue, and we will acknowledge receipt within one business day.