As AI processors move into ever larger, denser package and socket structures, contact quality and electrical integrity become a separate workflow that deserves its own system.
As AI packages drive socket complexity upward, the quality demands on contact structures become much more severe. This tester exists for that exact problem.
The system is positioned around the contact density and electrical risk of advanced packaged AI processors.
Focuses on the socket itself, rather than treating it as a side note inside a larger system.
Useful for teams that need a cleaner, repeatable process around socket validation and quality control.
