Probing Semiconductor

Mother board platforms for T5830 / T5833, M5, 93K, and real probe-card test workflows.

Mother board paths around T5830 / T5833, M5, and 93K sit together with PCT5801, DeepTouch1000, socket test, and broader semiconductor test workflows for production-side validation.

Products

Core systems and equipment lines.

Mother board support for T5830 / T5833, M5, and 93K sits alongside probe card validation, socket test, ATE-related workflows, and selected semiconductor equipment support.

Memory Probe Card Tester

Memory Probe Card Tester

Built for one-touchdown memory probe card workflows across NAND, NOR, DRAM, and higher pin-count validation scenarios.

AI Processor Socket Tester

AI Processor Socket Tester

Dedicated socket test coverage for AI processor packages where pin count and contact quality become the critical bottleneck.

Advantest EVA100 / ATE

Advantest EVA100 / ATE

Integrated circuit automatic test equipment for digital and mixed-signal workflows, with debugging, shmoo, and virtual instrument support.

PCT5801

PCT5801

Probe card electrical test platform with current mother board paths for T5830 / T5833, M5, and 93K, plus DC, AC / TDR, Kelvin, and control checks.

DeepTouch

DeepTouch

Automated probe card test machine with 1000 kgf chuck force, XYZ needle-tip inspection, and all-in-one operation with PCT5801.

Workflows

Built for real test and validation scenarios.

The product direction is clear: build a probe card test system for actual production-side workflows, not a generic analyzer.

One-touchdown probe card test

One-touchdown probe card test

Designed around actual wafer-test production conditions, with one-touchdown memory probe card handling for large-scale pin-count validation.

Electrical coverage

Electrical coverage

Supports open-short, leakage down to 10 nA class, control-resource verification, TDR / PBDATA, and Kelvin-related checks.

Physical validation and wafer sort

Physical validation and wafer sort

DeepTouch1000 covers incoming validation, contact performance, needle-tip consistency, visual inspection, and wafer-sort-oriented workflows.

Deployment

Current product shape and support scope.

The product stack is built from tester, prober, and interface-side experience, with clear system limits and installation coverage.

Capable tester ecosystems

Current and planned compatibility includes Advantest T5830 / T5833, Teradyne M5, Advantest V93000, and adjacent tester adaptation paths.

Probe station and card coverage

DeepTouch1000 supports vertical, cantilever, and MEMS probe cards, full-temperature validation, high load, and optional automation expansion.

Installed and applied

The system already has more than 10 installations in China and 1 in Korea, and is built around solving customer problems first.

Entities

Operating structure and business coordination.

The company has a Shanghai operating entity and a Hong Kong business entity, each serving a clear part of product execution and business coordination.

Shanghai operating entity

雯澜新(上海)半导体科技有限公司 handles product work, engineering execution, and customer support from Shanghai.

ShanghaiOperationsEngineering

Hong Kong business entity

雯澜实业香港有限公司 supports international business communication, supply-chain coordination, and regional commercial collaboration.

Hong KongBusinessSupply chain

Contact and support

Email: kenny@probing.com.cn
Phone: +86 13795427077
Office information and FAQ are available under Contact.

ContactEmailSupport