PCT5801 on site: the tester cabinet beside the prober, photographed installed

A test system, not a probe card analyzer

PCT5801 Probe Card Test System

PCT5801 sits between the ATE and the probe card, forming an end-to-end test path across full-function ATE, relay matrix, motherboard and card. It reproduces the project's specified tester electrical resources, motherboard routing and control-resource conditions rather than performing static resistance measurement alone, which is why it covers open, short, nA-level leakage, control resources and TDR transfer time.

Photographed on site: the PCT5801 tester cabinet beside the prober, with the whole-wafer result on the adjacent screen.
Card-side pins67,000
ATE resources256 pin/unit × up to 4 units
Relay matrix1,024 ch/piece × up to 64 pieces
Card interfaceZIF / POGO
The same points in words
Card-side pins
Current platform capacity; v2 architecture target 300,000
ATE resources
Full-function ATE front end
Relay matrix
Modular channel expansion
Card interface
Bridge Beam contact structure
Equipment and engineering solution

Applications

Designed for the following probe card manufacturing, test and maintenance tasks.

Release and post-repair test

Pre-ATE interface validation

High-channel expansion

The same points in words
Release and post-repair test
Check opens, shorts, leakage and control resources with a traceable report.
Pre-ATE interface validation
Verify motherboard, channel and basic electrical state before occupying a production tester.
High-channel expansion
Organize capacity around 1,024-channel modules and scale for the card and rack configuration.
SPECIFICATIONS

Specifications

The final configuration follows the card, interfaces, site conditions and acceptance items.

Card-side pinsCurrent platform capacity 67,000; PCT5801v2 architecture target 300,000v2 is planned to add PinForce and probe-tip XYZ, correlated with DeepTouch mechanical validation data
ATE resources256 pin per unit, up to 4 unitsConfigured for the target card and test items
Relay matrix1,024 channels per piece, up to 64 piecesChannel capacity scales with pin count
Motherboard interfaceZIF / POGO with Bridge BeamInterface form designed per customer card
Control resourcesRelay / FPGA / ASIC custom control; MCW (T5830 / T5833); SPI and I²C (M5 / M7)Control scheme matched to the tester platform
Analog testKelvin four-wire measurement with DPS device power supplyFor accurate analog measurement
See the full specification table
ItemSpecification / configurationNotes
Configurable resourcesControl, source-measure, digital, waveform and capture modules selected per test itemModule specifications are provided in the technical agreement
Virtual instrumentsSource and measure, digitizer, scope and spectrum analysis, pin-map visualisationSoftware instrument panels
Operator interfaceGraphical, customisable GUITest flow and display adapt to customer practice
What a channel meansChannel counts are electrical signals on the tester side, not probe-card pinsKeeps channel counts from being read as pin counts
Digital capability16,384 channels standard; 65,536 maximum configuration (matrix-scanned test paths)Channels are tester-side scanned signals, not probe-card pins; concurrent instrument resources follow the fitted units
Software toolsGraphical sequence programmer, digital vector editor and debugger, logic analyser, virtual instrument panels, shmoo debugger, automatic VI-curve reportsSupplied with the system
Data and reportsThe recipe system supports reuse and archiving, with automatic report generationData interfaces are agreed in the technical agreement
Site conditionsAir cooled; 15 to 30 °C, 30 to 70 % RH; AC 220 V 50/60 HzNominal for the base configuration; varies with configuration
WORKFLOW

Workflow

  1. 01

    Open test

  2. 02

    Short test

  3. 03

    Leakage test

  4. 04

    Control test

The same points in words
Open test
Continuity across all channels with every pin open
Short test
All pins on a short plate to detect channel-to-channel shorts
Leakage test
All pin-to-pin measurement against a 10 nA test threshold
Control test
MCW / FPGA / ASIC / I²C / SPI control-resource verification
EVIDENCE

The machine and its results

Chain diagram of the four scales: physical pins, addressable nodes, configured channels, concurrent resources
Four different quantities in one chain: card-side physical pins, matrix addressable nodes, tester-side configured channels, concurrent instrument resources. The four numbers are never interchangeable; concurrent-resource counts follow the fitted configuration and are stated in the technical agreement.
Screenshot of the tester's main screen: a per-needle table of DUT, ZIF, pin position, open-circuit resistance and leakage current
The tester's main screen: every needle listed by DUT, ZIF and pin position, with an open-circuit and a leakage verdict each.
Screenshot of a whole-wafer result map: a 29-row die grid in green for pass and red for fail, with a hover panel showing needle and channel
The whole-wafer result map: green passes, red fails; open one cell and you see which needles sit under that die and which tester channel each one reaches.
Photo of the motherboard contact area: ring-shaped mating face and contact element array
The motherboard contact area: the card's mating face and contact elements grouped by channel.
FAT / SAT

Project delivery

01

Sample evaluation

02

Technical agreement

03

FAT

04

SAT

The same points in words
Sample evaluation
Confirm the object, interfaces, current state, failure modes and available validation samples.
Technical agreement
Define configuration, measurement method, limits, takt, data interfaces and responsibilities.
FAT
Verify functions, repeatability, reporting and exception handling with agreed samples.
SAT
Complete site integration, training, upstream/downstream interfaces and issue closure.
CONFIGURATION

Configuration and acceptance

System configuration, optional items and acceptance conditions are summarized below.

Adapted tester platforms

Solution adapted and delivered: Advantest T5830 (440/480), T5833 (520), V93000 and Teradyne Magnum 5. Solution in build: Advantest T5221, CCTech C16/P16/P16+, Teradyne UltraFlex. Solution planned: XB1152, TM8000, SM0X00, M7, T5825.

AC test

The PBDATA test measures transfer time (TDR) across all signal channels; task times follow pin count and configuration and are agreed in the technical agreement.

Capability position

Covers DC, TDR, logic control and mechanical inspection within one system architecture, orchestrated per the ATE, relay-matrix and instrument configuration; general probe card analyzers usually cover only part of this.

Where it has been shown

Shown as a working machine at Semicon China (Shanghai), Semicon Southeast Asia (Singapore) and SWTest (US) in 2025.

Vendor-neutral

The system is configured around each customer's tester, motherboard, probe card and factory interfaces, tied to no single probe-card maker or ATE platform; quality, cost and lead time are set by contract.

Pins versus scan paths

The mapping from card pins to matrix scan paths is designed per card type; 67,000 is the card-side pin-capacity figure and 65,536 the independent scan-path ceiling - different quantities. The PCT5801v2 architecture extending toward 300,000 pins is presented in technical discussions.

Depth of this page

This page carries capability headlines with their evidence tiers; module specifications, task times and delivered-configuration detail are provided in the technical agreement.

Share the card, interfaces and target

Send the sample, installed equipment, current issue and target takt. We will acknowledge receipt within one business day.