From probe cutting to storage, which machines here are ours
The MEMS probe card manufacturing and verification flow drawn around Probing's own machines. Select any machine to see how the workpiece moves inside it. Probe fabrication, substrate and PCB are made by specialist suppliers and are compressed into the grey entry and exit.
- 01 · IncomingNot supplied
Incoming probes and substrates
Probes, substrate, PCB, guide plate arrive
MEMS probes, the space transformer, the probe card PCB and the guide plates are made by their own specialist suppliers and arrive here. Probing supplies no equipment for those steps; this entry only marks where material enters the line.
- 02 · AssemblyUnder improvement
Laser probe cutting
Cut to length and drop to tray
Probe stock is fed in as wire or as an array, a laser cuts each probe to the target length, and the cut probe drops into the tray for pickup. The drawing shows a generic industry configuration, not a measured mechanism of a specific machine.
Open the equipment page · MEMS Probe Card Pin Assembly and Laser Micro-Welding - 03 · AssemblyUnder improvement
Probe Pick and Alignment
Pick and align the probe
The pick gripper takes each probe from the tray and seats it against the fixed jaw of the alignment stage, which clamps it and corrects attitude and position, with jaw clearance matched to probe thickness.
Open the equipment page · MEMS Probe Card Pin Assembly and Laser Micro-Welding - 04 · AssemblyUnder improvement
Laser Micro-Welding Pin Attach
Laser micro-weld to pad
The weld gripper takes the aligned probe from the stage, places it on its substrate pad and runs the laser micro-weld, with joint energy and dwell time held in the recipe.
Open the equipment page · MEMS Probe Card Pin Assembly and Laser Micro-Welding - 05 · AssemblyUnder improvement
Post-Weld Autofocus Inspection
Autofocus weld check
An autofocus vision unit confirms the weld position and contact face of each finished joint, and the result is written to the work order with material, operator and recipe version, and serves as the contact-position reference for wafer electrical test.
Open the equipment page · MEMS Probe Card Pin Assembly and Laser Micro-Welding - 06 · TestIn production
Probe Tip XYZ and Planarity Metrology
Scan tip XYZ, planarity
The populated card is scanned probe by probe for tip X, Y and Z position, probe length and array planarity, and positions outside the project threshold are flagged by coordinate.
Open the equipment page · DeepTouch1000 Probe Station for Probe Card Test - 07 · TestIn production
Electrical Test (Open, Short, nA Leakage, Control Resources)
Open, short, nA leakage
The card is mated through the motherboard and driven through open, short, nA-level pin-to-pin leakage and control-resource checks, with TDR transfer time available as an added item and channel capacity configured from a 1,024-channel relay board, up to 64 boards.
Open the equipment page · PCT5801 Probe Card Test System - 08 · TestIn production
Whole-Card Touchdown and Load Validation
Touch down at 1000 kg
Common probe stations deliver 80–300 kg, short of the 450 kg-plus that whole-card validation needs, so the card is pressed down at 1000 kg chuck force to read overall load, contact state and probe marks across the array and map them back to the PCT5801 failure coordinates.
Open the equipment page · DeepTouch1000 Probe Station for Probe Card Test - 09 · ServiceRoadmap
Tip grinding and cleaning
Condition tips and clear residue
The card is run over a grinding plate along a set path to condition tip shape and height and to clear residue from the tips. This machine is a roadmap item, not yet delivered, and the drawing shows a generic industry configuration.
- 10 · ServiceIn production
Cleaning and Three-Direction Reinspection
Clean and reinspect 3-way
The card is cleaned by recipe with atomized IPA, controlled soft brushing and clean-gas blow-off with vacuum recovery of residue and particles, then re-imaged from three directions to judge residue, particles, bent probes and abnormal tip shape, with thresholds defined by the customer acceptance method.
Open the equipment page · Probe Card Cleaning and Three-Direction Reinspection - 11 · ServiceIn production
Traceable Storage and Handoff
Bind RFID, store, trace
Each card is RFID-bound and placed into an environment-controlled slot, with check-in, checkout, return and stocktake driven by WMS/EAP/MES tasks and handoff by manual, AMR, robot or OHT, while capacity and environmental targets are set per project.
Open the equipment page · Traceable Probe Card Storage System - 12 · OutputNot supplied
Packing and Shipment to Fab
Case, document and ship
The released card is put into its shipping case with desiccant and shock protection, documented, and transported to the customer fab's incoming dock; Probing's storage system covers in-plant checkout and downstream handoff only, so packing and shipment are not supplied.
Probing does not supply equipment for probe fabrication, incoming sorting, space transformer and PCB fabrication, guide-plate machining, card body integration, packing and shipment, or re-pinning, and this diagram is marked only from what the product pages on this site already state.
From probe cutting to storage, which machines here are ours
Probing does not supply equipment for probe fabrication, incoming sorting, space transformer and PCB fabrication, guide-plate machining, card body integration, packing and shipment, or re-pinning, and this diagram is marked only from what the product pages on this site already state.