进入HBM时代，对一次整面晶圆扎针的探针卡的检测，要求满足海量的测试通道，高精度的漏电检测，甚至还有对通道时间特性的检测要求，要求测试结果准确、测试时间短。我公司研发的PCT5801探针卡测试系统就是为此而生。

With the advent of the HBM era, probe card testing for full-wafer contact requires support for massive test channel counts, high-precision leakage current measurements, and even characterization of channel timing behavior. Accuracy and speed in testing are critical. Our company’s PCT5801 Probe Card Test System is purpose-built to meet these demanding requirements.

MEMS技术大幅提高了针卡的针数，也提高了对探针卡物理接触的要求。我司研发的DeepTouch1000探针卡测试专用探针台，实现了最大1000kgf的针卡承载力，实现了极高速的针尖3D位置量测，与我司的PCT5801可合为一体，降低使用成本，减小占地面积。

MEMS technology has significantly increased the pin count of probe cards, while also raising the requirements for physical contact performance. Our company’s DeepTouch1000 probe station is specially designed for probe card testing, supporting up to 1000 kgf of loading capacity. It enables ultra-high-speed 3D measurement of probe tip positions, and can be seamlessly integrated with our PCT5801 probe card test system—reducing overall cost and minimizing footprint.